Electrochemical adsorption studies of urea on copper surface in alkaline medium

被引：18

作者：

Altaf, Fouzia ^{[1
]}

Qureshi, Rumana ^{[1
]}

Ahmed, Safeer ^{[1
]}

Khan, Athar Y. ^{[1
]}

Naseer, Amtul ^{[1
]}

机构：

[1] Quaid I Azam Univ, Dept Chem, Islamabad, Pakistan

来源：

JOURNAL OF ELECTROANALYTICAL CHEMISTRY | 2010年 / 642卷 / 01期

关键词：

Copper; Cyclic voltammetry; EIS; Adsorption; INHIBITION; CORROSION; BEHAVIOR; ELECTRODE; FILM;

D O I：

10.1016/j.jelechem.2010.02.011

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

The inhibitive action of urea on the corrosion behavior of copper was investigated in borate buffer pH (8.4) by means of cyclic voltammetry and electrochemical impedance spectroscopy (EIS). A consistent trend of increase in inhibition efficiency was observed as a function of concentration of urea. The adsorption of urea on copper surface was found to obey the Langmuir adsorption isotherm with Delta G = -35.2 kJ/mole and adsorption constant K = 2.7 x 10(4) dm(3)/mole. Impedance spectroscopic measurements confirmed that charge transfer resistance increases in presence of urea upon increasing its concentration. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：98 / 101

页数：4

共 27 条

[1] PHOTORESPONSE OF OXIDE LAYERS ON COPPER IN AQUEOUS-ELECTROLYTES CONTAINING CORROSION-INHIBITORS [J].