Computational techniques for simulation of sub-micron thermal conduction

被引:0
|
作者
Murthy, JY [1 ]
Mathur, SR [1 ]
机构
[1] Purdue Univ, Dept Mech Engn, W Lafayette, IN 47907 USA
来源
THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS | 2002年
关键词
sub-micron; heat conduction; Boltzmann transport equation; numerical; finite volume; unstructured; coupled ordinates;
D O I
暂无
中图分类号
O414.1 [热力学];
学科分类号
摘要
Sub-micron heat conduction in dielectrics can be analyzed using the phonon Boltzmann Transport Equation (BTE) in the relaxation time approximation. The paper describes the development of unstructured finite volume numerical techniques to address the BTE. Spatial, angular, spectral and temporal discretization procedures are described. The performance of sequential solution procedures for the BTE is compared to that of a point-coupled algorithm called the coupled ordinate method (COMET). The sequential algorithm is shown to perform well for low acoustic thicknesses, but is quickly exceeded in performance by COMET as the acoustic thickness is increased. The proposed numerical schemes are applied to a variety of sub-micron conduction problems, both unsteady and steady. Favorable comparison is found with the published literature and with exact solutions.
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页码:45 / 60
页数:16
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