Dependence of ohmic contact properties on AlGaN layer thickness for AlGaN/GaN high-electron-mobility transistors

被引:13
作者
Takei, Yusuke [1 ]
Tsutsui, Kazuo [1 ]
Saito, Wataru [2 ]
Kakushima, Kuniyuki [1 ]
Wakabayashi, Hitoshi [1 ]
Iwai, Hiroshi [1 ]
机构
[1] Tokyo Inst Technol, Dept Elect & Appl Phys, Yokohama, Kanagawa 2268502, Japan
[2] Toshiba Co Ltd, Semicond & Storage Prod Co, Kawasaki, Kanagawa 2128583, Japan
关键词
N-TYPE GAN; HETEROSTRUCTURES; MECHANISM;
D O I
10.7567/JJAP.55.040306
中图分类号
O59 [应用物理学];
学科分类号
摘要
The dependence of ohmic contact resistance on the AlGaN layer thickness was evaluated for AlGaN/GaN high-electron-mobility transistor (HEMT) structures. Mo/Al/Ti contacts were formed on AlGaN layers with various thicknesses. The observed resistance characteristics are discussed on the basis of a model in which the overall contact resistance is composed of a series of three resistance components. Different dependences on the AlGaN layer thickness was observed after annealing at low temperatures (800-850 degrees C) and at high temperatures (900-950 degrees C). It was determined that lowering the resistance at the metal/ AlGaN interface and that of the AlGaN layer is important for obtaining low-resistance ohmic contacts. (C) 2016 The Japan Society of Applied Physics
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收藏
页数:4
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