共 50 条
- [44] THE INFLUENCE OF THE SOLVENT ON THE KINETICS OF SILVER ELECTRODEPOSITION JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1995, 381 (1-2): : 227 - 230
- [46] Electrophysical properties and electronic structure of tin-doped antimony telluride Physics of the Solid State, 2002, 44 : 1850 - 1853
- [47] Electrocrystallization and electrodeposition of silver on titanium nitride Journal of Applied Electrochemistry, 2000, 30 : 1261 - 1268
- [49] Electrodeposition and Corrosion Resistance of Copper-Tin Alloys from BMIC Ionic Liquid Xiyou Jinshu/Chinese Journal of Rare Metals, 2020, 44 (03): : 328 - 332