Pot Life Improvement of Low Temperature and High-speed Curable Anisotropic Conductive Adhesive (ACA)

被引:0
作者
Lee, Jong-Hyun [1 ]
Kim, Ju-Hyung [1 ]
Hyun, Chang-Yong [1 ]
机构
[1] Seoul Natl Univ Technol, Dept Mat Sci & Engn, Seoul 139743, South Korea
来源
2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2 | 2009年
关键词
RFID assembly; chip bonding; ACA (anisotropic conductive adhesive); high-speed curing; pot life; CHIP;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, the imidazole-based curing accelerator powders were coated with a chosen agent to increase the pot life of ACA resin formulation. To accomplish this simple procedure, the coating processes were tried with a vapor or molten state of the coating agent. The coating processes with the vapor state could not be considered as an effective conformal coating method. However, a coating process using the molten state was effective at increasing the pot life, and showed minor effect with regard to the curing rate and processability Of final formulation.
引用
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页码:294 / 298
页数:5
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