Quantitative determination of the defects in TC4 diffusion bonded joints via ultrasonic C-scan

被引：11

作者：

Song, Wenqing ^{[1
,2
]}

Ren, Jin ^{[3
]}

He, Peng ^{[1
]}

Sun, Jingru ^{[3
]}

Shi, Junmiao ^{[3
]}

Xiong, Jiangtao ^{[3
]}

Li, Jinglong ^{[3
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

[2] Aero Engine Corp China, Shenyang Liming Aeroengine Corp Ltd, Shenyang 110043, Peoples R China

[3] Northwestern Polytech Univ, Shaanxi Key Lab Frict Welding Technol, Xian 710072, Peoples R China

来源：

JOURNAL OF MANUFACTURING PROCESSES | 2021年 / 64卷

基金：

中国国家自然科学基金; 中国博士后科学基金;

关键词：

TC4; Diffusion bonding; Ultrasonic C-scan; Signal processing; QUALITY; ALLOY; MICROSTRUCTURE; STRENGTH;

D O I：

10.1016/j.jmapro.2021.03.004

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Ultrasonic C-scan was conducted to detect the defect size of TC4 diffusion-bonded joints quantitatively. Additionally, C-scan images were obtained using the amplitudes of time-domain signal, main frequency of frequencydomain signal, and amplitudes of main frequency in power spectrum as the characteristic parameters. The results demonstrated that the C-scan detection based on the time-domain amplitude was feasible to characterize the defects with sizes larger than double the focal spot diameter of the probe accurately and quantitatively. When the defect size was larger than the focal spot diameter, the detection error of using the main frequency of frequencydomain signal was below 5%. For defects smaller than the diameter of the focal spot, the highest detection accuracy was obtained by ultrasonic C-scan based on the power spectrum.

引用

页码：1476 / 1483

页数：8

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