FEM Simulation of Cracks in MLCC during Reflow Soldering

被引：0

作者：

Al Ahmar, Joseph ^{[1
]}

Wiese, Steffen ^{[1
]}

机构：

[1] Saarland Univ, Saarbrucken, Germany

来源：

2017 18TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) | 2017年

关键词：

SNPB SOLDER; BEHAVIOR; JOINTS; SNAGCU;

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper presents results of FEM Simulation and a statistical analysis for cracks in Multilayer Ceramic Capacitors (MLCCs). The main objective of the analysis is to validate the results of bending experiments on MLCCs and mainly the influence of solder type on fracture susceptibility and fracture form in ceramic body. The model also considers the prestresses occurring in the capacitor during firing and soldering process and their corresponding failure mechanisms.

引用

页数：4

共 5 条

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