Influence of the source-gate distance on the AlGaN/GaN HEMT performance

被引:59
作者
Russo, Stefano [1 ]
Di Carlo, Aldo [1 ]
机构
[1] Univ Roma Tor Vergata, Dept Elect Engn, I-00133 Rome, Italy
关键词
device scaling; gallium nitride; HEMT; Monte Carlo simulations; output current; transconductance;
D O I
10.1109/TED.2007.894614
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we present Monte Carlo simulation results on the source-gate (S-G) scaling effects in GaN-based HEMTs. The results show that a downscaling of the S-G distance can improve device performance, enhancing the output current and the device transconductance. The main reason for this effect is related to the peculiar dynamic of electrons in the GaN-based HEMTs, which leads to a nonsaturated velocity regime in the source access region, even for high drain applied voltages. On the contrary, the gate-drain distance does not affect the output current within the analyzed device geometries. Based on these results, new optimization strategies for GaN HEMTs could be defined.
引用
收藏
页码:1071 / 1075
页数:5
相关论文
共 16 条
[1]   Monte Carlo study of the dynamic breakdown effects in HEMT's [J].
Di Carlo, A ;
Rossi, L ;
Lugli, P ;
Zandler, G ;
Meneghesso, G ;
Jackson, M ;
Zanoni, E .
IEEE ELECTRON DEVICE LETTERS, 2000, 21 (04) :149-151
[2]   MONTE-CARLO SIMULATION OF TRANSPORT IN TECHNOLOGICALLY SIGNIFICANT SEMICONDUCTORS OF THE DIAMOND AND ZINCBLENDE STRUCTURES .1. HOMOGENEOUS TRANSPORT [J].
FISCHETTI, MV .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (03) :634-649
[3]  
GONZALEZ SANCHEZ T, 1992, SEMICOND SCI TECH, V7, P31, DOI 10.1088/0268-1242/7/1/006
[4]   High performance 0.25 μm gate-length AlGaN/GaN HEMTs on sapphire with power density of over 4.5 W/mm at 20 GHz [J].
Kumar, V ;
Kuliev, A ;
Schwindt, R ;
Muir, M ;
Simin, G ;
Yang, J ;
Khan, MA ;
Adesida, I .
SOLID-STATE ELECTRONICS, 2003, 47 (09) :1577-1580
[5]   Unpassivated AlGaN/GaN HEMTs with CW power density of 3.2 W/mm at 25 GHz grown by plasma-assisted MBE [J].
Manfra, M ;
Weimann, N ;
Baeyens, Y ;
Roux, P ;
Tennant, DM .
ELECTRONICS LETTERS, 2003, 39 (08) :694-695
[6]   Influence of the dynamic access resistance in the gm and fT linearity of AlGaN/GaN HEMTs [J].
Palacios, T ;
Rajan, S ;
Chakraborty, A ;
Heikman, S ;
Keller, S ;
DenBaars, SP ;
Mishra, UK .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2005, 52 (10) :2117-2123
[7]   Scaling effects in AlGaN/GaN HEMTs: Comparison between Monte Carlo simulations and experimental data [J].
Russo, S. ;
Di Carlo, A. ;
Ruythooren, W. ;
Derluyn, J. ;
Germain, M. .
JOURNAL OF COMPUTATIONAL ELECTRONICS, 2006, 5 (2-3) :109-113
[8]   Recessed-gate structure approach toward normally off high-voltage AlGaN/GaN HEMT for power electronics applications [J].
Saito, W ;
Takada, Y ;
Kuraguchi, M ;
Tsuda, K ;
Omura, I .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2006, 53 (02) :356-362
[9]   Design optimization of high breakdown voltage AlGaN-GaN power HEMT on an insulating substrate for RONA-VB tradeoff characteristics [J].
Saito, W ;
Kuraguchi, M ;
Takada, Y ;
Tsuda, K ;
Omura, I ;
Ogura, T .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2005, 52 (01) :106-111
[10]   Growth and passivation of AlGaN/GaN hetero structures [J].
Shealy, JR ;
Prunty, TR ;
Chumbes, EM ;
Ridley, BK .
JOURNAL OF CRYSTAL GROWTH, 2003, 250 (1-2) :7-13