Determining the machining parameters for femtosecond laser helical drilling of aluminosilicate glass substrate

被引:20
作者
Lee, Hyeon-Min [1 ]
Choi, Jung Hyun [2 ]
Moon, Seung-Jae [1 ]
机构
[1] Hanyang Univ, Dept Mech Engn, Seoul 04763, South Korea
[2] Ewha Womans Univ, Dept Environm Sci & Engn, 52 Ewhayeodae Gil, Seoul 03760, South Korea
基金
新加坡国家研究基金会;
关键词
Glass; Drilling; Femotosecond laser; ABLATION;
D O I
10.1007/s12541-017-0109-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, a new laser helical drilling method with high geometrical accuracy is proposed for aluminosilicate glass (ASG) substrates. Laser drilling was performed from the bottom of the substrate to reduce the taper angle. The 400 mu m-thick ASG substrates were drilled via a femtosecond laser beam with a wavelength of 1552 nm and a pulse duration of 800 fs. By applying this newly suggested method, thru-holes can be produced with a high roundness accuracy that is less than 20 mu m, a small taper angle, low surface roughness of the sidewall, and high quality laser-drilled edges without cracks or chippings for hole diameters of 0.5, 1, 2, and 3 mm. Correlations are proposed between laser drilling parameters, such as ablation depth, scanning speed, vertical motion speed, and helical layer pitch, each of which are critical variables in drilling thru-holes in ASG substrates. Good surface quality of thru-holes can be experimentally obtained using the machining parameter values estimated by the proposed theory.
引用
收藏
页码:923 / 930
页数:8
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