Investigation of forced convection through entrance region of a porous-filled microchannel: An analytical study based on the scale analysis

被引:46
作者
Dehghan, Maziar [1 ]
Valipour, Mohammad Sadegh [1 ]
Saedodin, Seyfolah [1 ]
Mahmoudi, Yasser [2 ]
机构
[1] Semnan Univ, Fac Mech Engn, Semnan, Iran
[2] Univ Cambridge, Dept Engn, Cambridge CB2 1PZ, England
关键词
Porous-microchannel; Thermally developing flow; Slip-flow regime; Local thermal non-equilibrium; Thermal entry length; Scale-perturbation analysis; THERMAL NONEQUILIBRIUM CONDITION; RADIATION HEAT-TRANSFER; GASEOUS SLIP-FLOW; BOUNDARY-CONDITIONS; GAS-FLOW; MEDIA; CHANNEL; CONDUCTION; MICROTUBE; MODEL;
D O I
10.1016/j.applthermaleng.2015.12.086
中图分类号
O414.1 [热力学];
学科分类号
摘要
The thermally developing forced convection heat transfer in a micro-channel filled with a porous material in the slip-flow regime is analyzed. Channel walls are subjected to a constant heat flux. The local thermal non-equilibrium (LTNE) condition is considered and both the fluid and solid phases in the porous region are assumed to have internal heat generation. According to a perturbation analysis assuming small temperature difference between the two phases obtained by the scale analysis, we show that there is no need to apply a thermal boundary condition model at the channel wall. Thus, we obtained an analytical solution for the thermally developing Nusselt number (Nu) using no model. Thermal boundary condition models (A and B) are also used to find the temperature jump at the wall. Comparing Nu of models A and B with the pure perturbation analysis (using no model) and with the solution under local thermal equilibrium (LTE) condition reveals that model B cannot predict the LTE condition when a temperature jump exists on the wall. Hence, model A may be the only valid scenario in the slip-flow regime. In addition, expressions for the thermal entry length (chi(developing)) are proposed. An increase in beta as well as a decrease in the thermal conductivity ratio (k) decrease chi(developing). (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码:446 / 454
页数:9
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