Operation of 1.2-kV 4H-SiC Accumulation and Inversion Channel Split-Gate (SG) MOSFETs at Elevated Temperatures

被引:14
作者
Han, Kijeong [1 ]
Baliga, B. J. [1 ]
机构
[1] North Carolina State Univ, PowerAmer Inst, Raleigh, NC 27695 USA
关键词
Elevated temperature; gate charge; high-frequency figures-of-merit (HF-FOM); MOSFET; reverse transfer capacitance; silicon carbide (SiC); split gate (SG);
D O I
10.1109/TED.2018.2841940
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Numerical simulations, with experimental validation, have been used to demonstrate that the 1.2-kVrated accumulation and inversion mode channel 4H-SiC split-gate MOSFETs (SG-MOSFETs) have superior highfrequency figures-of-merit (HF-FOM) at elevated temperatures up to 150 degrees C. The measured electrical characteristics are reported for the first time for devices fabricated in a 6 '' SiC manufacturing foundry. The accumulation mode SG-MOSFET provides a better on-resistance than that of the inversionmode SG-MOSFET due to a higher channelmobility resulting in 1.2x smaller HF-FOMs at both room temperature and 150 degrees C. The accumulation mode SG-MOSFET is demonstrated to have 2.4x and 2.1x smaller HF-FOM [R-ON x C-gd] and HF-FOM [R-ON x Q(gd)] at 150 degrees C, respectively, compared with the typical commercially available MOSFET.
引用
收藏
页码:3333 / 3338
页数:6
相关论文
共 17 条
[1]  
Baliga B.J., 2008, Fundamentals of Power Semiconductor Devices, P279
[2]  
Baliga B.J., 2017, GALLIUM NITRIDE SILI, P287
[3]  
Baliga BJ, 2005, SILICON RF POWER MOSFETS, P1, DOI 10.1142/9789812569325
[4]  
Chen XK, 2017, AER ADV ENG RES, V100, P1
[5]   High-temperature operation of SiC planar ACCUFET [J].
Chilukuri, RK ;
Shenoy, PM ;
Baliga, BJ .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 1999, 35 (06) :1458-1462
[6]   Split-Gate 1.2-kV 4H-SiC MOSFET: Analysis and Experimental Validation [J].
Han, Kijeong ;
Baliga, B. J. ;
Sung, Woongje .
IEEE ELECTRON DEVICE LETTERS, 2017, 38 (10) :1437-1440
[7]   Challenges in SiC power MOSFET design [J].
Matocha, Kevin .
SOLID-STATE ELECTRONICS, 2008, 52 (10) :1631-1635
[8]   Electron mobility models for 4H, 6H, and 3C SiC [J].
Roschke, M ;
Schwierz, F .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (07) :1442-1447
[9]   A NEW VDMOSFET STRUCTURE WITH REDUCED REVERSE TRANSFER CAPACITANCE [J].
SAKAI, T ;
MURAKAMI, N .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (07) :1381-1386
[10]  
Schroder D.K., 2015, Semiconductor Material and Device Characterization, V3rd ed.