Insight into the wetting behavior of AgCu-xTi on ZrO2: Spreading and microstructural evolution

被引:8
作者
Zhou, Wenlong [1 ]
Liu, Di [1 ]
Fu, Wei [1 ,2 ]
Wang, Huaijin [1 ,2 ]
Song, Xiaogong [1 ,2 ,3 ]
Hu, Shengpeng [1 ,2 ]
Niu, Hongwei [3 ]
机构
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, Shandong Prov Key Lab Special Welding Technol, Weihai, Peoples R China
[3] Shandong Inst Shipbldg Technol, Weihai, Peoples R China
基金
中国国家自然科学基金;
关键词
interfaces; microstructure; Ti; wetting; zirconia; MECHANICAL-PROPERTIES; INTERFACIAL MICROSTRUCTURE; ZIRCONIA; CU; ALLOY; ALUMINA; WETTABILITY; YSZ;
D O I
10.1111/jace.18593
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Understanding the wetting behavior is significant to the fabrication of ceramic/ceramic (or metal) components. Here, the typical AgCu-xTi/ZrO2 system is selected and its wetting behavior is studied by improved sessile drop method for various Ti content (x = 1, 2, 3, 4, wt%) at temperature range of 800 degrees C to 950 degrees C. The spreading of AgCu-xTi melt on ZrO2 substrate consists of two stages: (I) rapid-spreading stage and (II) sluggish-spreading stage. The spreading is determined by the interfacial interactions. Two kinds of products, TiO and Cu3Ti3O, nucleate and grow at the interface. Because of their metallic property, the wettability of AgCu-xTi/ZrO2 is significantly improved. Before continuous layer forms, the transportation of reactive mass is fast. Therefore, plenty of interfacial products precipitate at the interface resulting in the rapid spreading of AgCu-xTi melt on ZrO2. After that, the formed continuous acts as barrier suppressing interfacial reactions, thereby a sluggish-spreading stage is followed. This work provides insights into the interfacial microstructure inducing spreading of the AgCu-xTi/ZrO2 system.
引用
收藏
页码:6076 / 6085
页数:10
相关论文
共 38 条
[1]  
ALBRECHT M, 1994, SCANNING MICROSCOPY, V8, P925
[2]   Low-Temperature Interface Reaction Between Titanium and the Eutectic Silver-Copper Brazing Alloy [J].
Andrieux, J. ;
Dezellus, O. ;
Bosselet, F. ;
Viala, J. C. .
JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION, 2009, 30 (01) :40-45
[3]   Wetting and low temperature bonding of zirconia metallized with Sn0.3Ag0.7Cu-Ti alloys [J].
Bian, H. ;
Fu, W. ;
Lei, Y. Z. ;
Song, X. G. ;
Liu, D. ;
Cao, J. ;
Feng, J. C. .
CERAMICS INTERNATIONAL, 2018, 44 (10) :11456-11465
[4]   Reactive wetting and interfacial characterization of ZrO2 by SnAgCu-Ti alloy [J].
Bian, Hong ;
Zhou, Yuexin ;
Song, Xiaoguo ;
Hu, Shengpeng ;
Shi, Bin ;
Kang, Jiarui ;
Feng, Jicai .
CERAMICS INTERNATIONAL, 2019, 45 (06) :6730-6737
[5]   Brazing ZrO2 ceramic to Ti-6Al-4V alloy using NiCrSiB amorphous filler foil: Interfacial microstructure and joint properties [J].
Cao, J. ;
Song, X. G. ;
Li, C. ;
Zhao, L. Y. ;
Feng, J. C. .
MATERIALS CHARACTERIZATION, 2013, 81 :85-91
[6]   Brazing of zirconia with AgCuTi and SnAgTi active filler metals [J].
Chuang, TH ;
Yeh, MS ;
Chai, YH .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2000, 31 (06) :1591-1597
[7]   Interfacial reaction behavior and mechanical characterization of ZrO2/TC4 joint brazed by Ag-Cu filler metal [J].
Dai, Xiangyu ;
Cao, Jian ;
Liu, Jiaqi ;
Wang, Dong ;
Feng, Jicai .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2015, 646 :182-189
[8]   Thermodynamic modelling of the Ag-Cu-Ti ternary system [J].
Dezellus, Olivier ;
Arroyave, Raymundo ;
Fries, Suzana G. .
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH, 2011, 102 (03) :286-297
[9]   Low-temperature ultrasound-activated joining of ZrO2 ceramics using Sn-Al-Cu solder [J].
Dong, Hongjie ;
Li, Zhuolin ;
Song, Xiaoguo ;
Guo, Xiajun ;
Luo, Yanxu ;
Bai, Tiansheng ;
Wei, Shoujing ;
Zhao, Hongyun ;
Yan, Jiuchun ;
Feng, Jicai .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2019, 102 (05) :2272-2277
[10]   The role of reactivity in wetting by liquid metals: a review [J].
Eustathopoulos, N. ;
Voytovych, R. .
JOURNAL OF MATERIALS SCIENCE, 2016, 51 (01) :425-437