Dynamic latchup study using transmission line pulses and picosecond imaging circuit analysis

被引：0

作者：

Stellari, F ^{[1
]}

Weger, AJ ^{[1
]}

Song, PL ^{[1
]}

McManus, MK ^{[1
]}

机构：

[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA

来源：

ESSDERC 2004: PROCEEDINGS OF THE 34TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE | 2004年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work we present a methodology based on the combination of Transmission Line Pulses (TLP) stimulation and Picosecond Imaging Circuit Analysis (PICA) for studying the dynamic onset of latchup. A mathematical model based on carrier recombination equations is also discussed and shows to be in very good agreement with experimental data.

引用

页码：205 / 208

页数：4

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