Dynamic latchup study using transmission line pulses and picosecond imaging circuit analysis

被引:0
|
作者
Stellari, F [1 ]
Weger, AJ [1 ]
Song, PL [1 ]
McManus, MK [1 ]
机构
[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
来源
ESSDERC 2004: PROCEEDINGS OF THE 34TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE | 2004年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work we present a methodology based on the combination of Transmission Line Pulses (TLP) stimulation and Picosecond Imaging Circuit Analysis (PICA) for studying the dynamic onset of latchup. A mathematical model based on carrier recombination equations is also discussed and shows to be in very good agreement with experimental data.
引用
收藏
页码:205 / 208
页数:4
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