Strain relaxation of epitaxial CoSi2 and SiGe layers in cap-Si/Si0.83Ge0.17/Si(001) and epi-CoSi2/Si0.83Ge0.17/Si(001) structures

被引:3
作者
Shin, DO
Sardela, MR
Ban, SH
Lee, NE
Shim, KH
机构
[1] Sungkyunkwan Univ, Ctr Adv Plasma Surface Technol, Dept Mat Engn, Suwon 440746, Kyunggi Do, South Korea
[2] Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA
[3] Elect & Telecommun Res Inst, Semicond Elect, Taejon 305600, South Korea
关键词
silicon germanium; epitaxial cobalt disilicide; strain relaxation;
D O I
10.1016/j.apsusc.2004.06.118
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Strain relaxation behaviors of the epitaxial CoSi2 (epi-CoSi2) and Si0.83Ge0.17 layers in epi-CoSi2/Si0.83Ge0.17/Si(0 0 1) and cap-Si/Si0.83Ge0.17/Si(0 0 1) structures were investigated by high-resolution X-ray diffraction (HR-XRD) analyses. Samples were treated at the temperature, T-A = 650-900 degreesC by rapid thermal annealing. Comparative measurements showed a different strain relaxation behavior in the SiGe layers with and without COSi2 layer. And Ge content and lattice mismatch in the SiGe film of the epi-CoSi2/Si0.83Ge0.17/Si(0 0 1) are smaller than those in the SiGe layer in cap-Si/SiGe/Si(0 0 1) possibly due to the diffusion of Ge into the tensile-stressed epi-CoSi2 layer to reduce the compressive stress in the SiGe layer at elevated temperature. The analyses of high-resolution omega-2theta scan spectra and reciprocal space mapping showed that epi-CoSi2 layer is under tensile residual stress and a significant strain relaxation starts at T-A = 900 degreesC indicating of thermal stability up to TA 850 degreesC. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:139 / 145
页数:7
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