Condensation heat transfer enhancement by surface modification on a monolithic copper heat sink

被引：32
作者：
Huang, Ding-Jun [1 ,3 ]
Leu, Tzong-Shyng [2 ,3 ]
机构：
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
[2] Natl Cheng Kung Univ, Dept Aeronaut & Astronaut, Tainan 70101, Taiwan
[3] Natl Cheng Kung Univ, Inst Nanotechnol & Microsyst Engn, Tainan 70101, Taiwan
来源：
APPLIED THERMAL ENGINEERING | 2015年 / 75卷
关键词：
Copper surface modification; Superhydrophobic; Condensation heat transfer; PROMOTE DROPWISE CONDENSATION; SUPERHYDROPHOBIC SURFACES; ORGANIC COATINGS; STEAM; FABRICATION; DEPOSITION; ALUMINUM; ADHESION; TUBES; WATER;
D O I：
10.1016/j.applthermaleng.2014.10.019
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
In this study, the condensation heat transfer performance on a pure copper surface, as well as a superhydrophobic-modified copper surface were compared. Differing from other condensation heat transfer experimental designs, a monolithic copper heat sink was utilized in this study to prevent contact thermal resistance and/or thermal conduction limitation of the thermal paste applied between the modified condensation surface and heat sink plate. This approach has not yet been documented in the literature. The superhydrophobic copper heat sink surface was prepared using a hydrogen peroxide immersion and fluorosilane polymer (EGC-1720) spin-coating. Experimental results show that the condensation heat transfer performance on the superhydrophobic copper surface is superior to that of a pure copper surface. Additionally, durability tests of the pure and superhydrophobic coating copper surfaces in a harsh vapor environment are discussed in this study. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码：908 / 917
页数：10
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