Analysis of a large number of vias and differential signaling in multilayered structures

A method is presented for full-wave modeling of vertical vias in multilayered integrated circuits. The analysis of the interior problem is based upon the cylindrical wave expansion of the magnetic field Green's function. The multiple interaction among vertical vias is modeled by the Foldy-Lax scattering formula. Multi-layered effects are included by using cascaded network of the single-layer components. The exterior problem of the via and the transmission line is analyzed using the method of moments approach. The exterior and interior problems are combined into a system of equations to facilitate the solution of a large number of vias. Using this approach, the scattering matrix of problems of several thousand vias can be calculated with moderate CPU and memory requirement. Numerical results have been obtained for different via configurations and for a large range of frequency. Also illustrated are results for common and differential mode in differential signaling with surrounding idle and shorting vias.