A Comparative Study on Si Activation in GaAs Between Laser Annealing and Rapid Thermal Annealing

被引:2
作者
Ong, C. Y. [1 ]
Pey, K. L. [1 ]
Ng, C. M. [2 ]
Ong, B. S. [1 ]
Wong, C. P. [3 ]
Shen, Z. X. [3 ]
Xing, Z. X. [2 ]
Wang, X. C. [4 ]
Zheng, H. Y. [4 ]
Chan, L. [2 ]
机构
[1] Nanyang Technol Univ, Sch Elect & Elect Engn, Ctr Microelect, Singapore 639798, Singapore
[2] GLOBALFOUNDRIES Singapore Private Ltd, Singapore 738406, Singapore
[3] Nanyang Technol Univ, Sch Phys & Math Sci, Div Phys & Appl Phys, Singapore 637371, Singapore
[4] Singapore Inst Mfg Technol, Singapore 638075, Singapore
关键词
N-GAAS;
D O I
10.1149/1.3376388
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
This work studies the use of pulsed laser annealing (LA) to realize high n-type dopant activation in GaAs. The results show that the defects induced by ion implantation can be effectively eliminated by pulsed LA. Besides preserving a good crystalline structure, a much higher dopant activation can be achieved by LA compared to the conventional rapid thermal annealing technique. The high levels of dopant activation obtained in the laser-annealed GaAs samples are attributed to the out-diffusion of the Zn dopant atoms (the p-type dopant of the GaAs substrate) as well as the Ga atoms from the substrate. Diodes activated by an appropriate fluence exhibit excellent rectifying characteristics. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3376388] All rights reserved.
引用
收藏
页码:II200 / II202
页数:3
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