60 GHz Industrial Radar Systems in Silicon-Germanium Technology

被引：0

作者：

Agethen, R. ^{[1
]}

PourMousavi, M. ^{[1
]}

Forstner, H. P. ^{[2
]}

Wojnowski, M. ^{[2
]}

Pressel, K. ^{[3
]}

Weigel, R. ^{[1
]}

Kissinger, D. ^{[1
]}

机构：

[1] Univ Erlangen Nurnberg, Inst Elect Engn, Cauerstr 9, D-91058 Erlangen, Germany

[2] Infineon Technol, D-85579 Neubiberg, Germany

[3] Infineon Technol, D-93049 Regensburg, Germany

来源：

2013 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (IMS) | 2013年

关键词：

60; GHz; transceiver; SiGe; millimeter wave; eWLB; radar;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a fully integrated 60 GHz SiGe transceiver for industrial radar applications. The transceiver is packaged in an eWLB technology which allowes for direct embedding of two dipole antennas in the package. The compact transceiver frontend has been evaluated in an FMCW radar setup. The transceiver features a wide tunable operating range and is comprised of a vector modulator and a homodyne IQ receiver. The overall transceiver MMIC has a maximum output power of 3dBm and an overall power consumption of less then 1W. The directivity of the embedded antenna is 9 dBi and shows an operating bandwidth of 5 GHz.

引用

页数：3

共 7 条

[1] SiGe bipolar technology for automotive radar applications [J].

Böck, J ;

Schäfer, H ;

Aufinger, K ;

Stengl, R ;

Boguth, S ;

Schreiter, R ;

Rest, M ;

Knapp, H ;

Wurzer, M ;

Perndl, W ;

Böttner, T ;

Meister, TF .

PROCEEDING OF THE 2004 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 2004, :84-87

[2] A homodyne transceiver MMIC using SiGe:C technology for 60 GHz wireless applications [J].

Forstner, Hans Peter ;

Ortner, Markus ;

Verweyen, Ludger ;

Knapp, Herbert .

INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES, 2011, 3 (02) :147-155

[3]

Glisic S., 2011, 2011 IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2011), P149, DOI 10.1109/SIRF.2011.5719304

[4]

Ortner Markus, 2011, 2011 IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2011), P145, DOI 10.1109/SIRF.2011.5719340

[5]

PourMousavi M., 2012, P 19 INT C MICR RAD, V2, P709

[6]

Wojnowski M., 2011, 2011 IEEE 13th Electronics Packaging Technology Conference (EPTC 2011), P423, DOI 10.1109/EPTC.2011.6184458

[7] Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios [J].

Zhang, Y. P. ;

Sun, M. ;

Chua, K. M. ;

Wai, L. L. ;

Liu, Duixian .

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2009, 57 (10) :2842-2852

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