Kinetics of Corrosion Film Growth on Copper in Neutral Chloride Solutions Containing Small Concentrations of Sulfide

被引：99

作者：

Chen, J. ^{[1
]}

Qin, Z. ^{[1
]}

Shoesmith, D. W. ^{[1
]}

机构：

[1] Univ Western Ontario, Dept Chem, London, ON N6A 5B7, Canada

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2010年 / 157卷 / 10期

关键词：

IN-SITU STM; DILUTE HCL SOLUTIONS; WET-DRY CONDITIONS; CU(100) ELECTRODES; CU(111) ELECTRODES; ATOMIC-RESOLUTION; MAGNESIUM ALLOY; MICRO-DROPLETS; ADSORPTION; MEDIA;

D O I：

10.1149/1.3478570

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The corrosion behavior of oxygen-free copper in an anoxic 0.1 M NaCl + 5 x 10(-4) M Na(2)S solution was studied using electrochemical impedance spectroscopy, scanning electron microscopy equipped with a focused ion beam, X-ray photoelectron spectroscopy and micro X-ray diffraction. The corrosion film grew as a coherent, compact crystalline layer with a nonuniform thickness. The growth kinetics obeyed a parabolic law consistent with control by a diffusion process. Once a coherent layer was established, film growth kinetics appeared to be controlled by Cu(+) ion diffusion through the film. At shorter times before a coherent film was established, SH(-) diffusion in solution exhibited a considerable influence on the growth rate. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3478570] All rights reserved. 2

引用

页码：C338 / C345

页数：8

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