A high-performance InGaZnO (IGZO) thin-film transistor (TFT) with ZrO2-Al2O3 bilayer gate insulator is fabricated. Compared to IGZO-TFT with ZrO2 single gate insulator, its electrical characteristics are significantly improved, specifically, enhancement of I-on/I-off ratios by one order of magnitude, increase of the field-effect mobility (from 9.8 to 14 cm(2)/Vs), reduction of the subthreshold swing from 0.46 to 0.33 V/dec, the maximum density of surface states at the channel-insulator interface decreased from 4.3 x 10(12) to 2.5 x 10(12) cm(-2). The performance enhancements are attributed to the suppression of leakage current, smoother surface morphology, and suppression of charge trapping by using Al2O3 films to modify the high-k ZrO2 dielectric. (C) 2014 Elsevier Ltd. All rights reserved.