Characterization of the microstructure of tin-silver lead free solder

被引：18

作者：

Hurtony, Tamas ^{[1
]}

Szakal, Alex ^{[2
]}

Almasy, Laszlo ^{[2
]}

Len, Adel ^{[2
,4
]}

Kugler, Sandor ^{[3
]}

Bonyar, Attila ^{[1
]}

Gordon, Peter ^{[1
]}

机构：

[1] Budapest Univ Technol & Econ, Dept Elect Technol, Egry Jozsef Utca 18, H-1111 Budapest, Hungary

[2] Wigner Res Ctr Phys, Neutron Spect Dept, Budapest, Hungary

[3] Budapest Univ Technol & Econ, Dept Theoret Phys, Egry Jozsef Utca 18, H-1111 Budapest, Hungary

[4] Univ Pecs, Fac Engn & Informat Technol, Pecs, Hungary

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2016年 / 672卷

关键词：

Intermetallics; Rapid-solidification; Quenching; Microstructure; Electrochemical impedance spectroscopy; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; MECHANICAL-PROPERTIES; SN-CU; BEHAVIOR; MICROHARDNESS; ALLOY; SOLIDIFICATION; PARAMETERS; CORROSION; JOINTS;

D O I：

10.1016/j.jallcom.2016.02.177

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the beta-Sn and Ag3Sn phases. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：13 / 19

页数：7

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