Use of Nanoparticles of a Finely Dispersed Silicon Carbide Obtained in an Electrothermal Boiling Bed as a Structural Modifier of Thermoplastic Polymers

被引:4
|
作者
Dubkova, V. I. [1 ,2 ]
Borodulya, V. A. [3 ]
Vinogradov, L. M. [3 ]
Danilova-Tret'yak, S. M. [3 ]
Evseeva, L. E. [3 ]
Pinchuk, T. I. [4 ]
机构
[1] Acad Sci Belarus, Inst Gen & Inorgan Chem, 9 Surganov Str, Minsk 220072, BELARUS
[2] MEDBIOTECH Co, 51 Korol Str, Minsk 220004, BELARUS
[3] Natl Acad Sci Belarus, AV Luikov Heat & Mass Transfer Inst, 15 P Brovka Str, Minsk 220072, BELARUS
[4] OV Roman Inst Powder Met, 41 Platonov Str, Minsk 220005, BELARUS
关键词
finely dispersed silicon carbide; silicon-carbide nanoparticles; composite materials; physiochemical interaction; structure; properties;
D O I
10.1007/s10891-019-02041-2
中图分类号
O414.1 [热力学];
学科分类号
摘要
Porous powders of a finely dispersed silicon carbide obtained as a result of the carbothermal reduction of silica in an electrothermal boiling-bed reactor were investigated. It was established that such a powder comprises silicon-carbide nanoparticles of size similar to 50-70 nm and filametry formations of these nanoparticles with an aspect ratio of similar to 5-15. It is shown that the silicon-carbide nanoparticles introduced in a thermoplastic polymer interact with its matrix and, in so doing, change the polymer structure, with the result that a composite material is formed. Such thermoplastic polymer composites possess enhanced physical, mechanical thermal, and thermophysical properties. New heat-conducting polymer composite materials having a high wear resistance and good antifriction properties have been developed. These materials can be used in machine building as protective coatings, members, and units of facilities operating in the regime of abrasive wear, in power and electrical engineering, and in microelectronics where there is a need for heat-conducting thermoplastic polymer materials.
引用
收藏
页码:1253 / 1266
页数:14
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    V. I. Dubkova
    V. A. Borodulya
    L. M. Vinogradov
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    Journal of Engineering Physics and Thermophysics, 2019, 92 : 1253 - 1266
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