Investigation into the Anodic Dissolution Processes of Copper in Neutral and Acidic Sulfate Solutions with the In-line Digital Holography

被引：6

作者：

Hu, Yongpan ^{[1
]}

Li, Xijiao ^{[1
]}

Jiao, Zhijuan ^{[1
]}

Gao, Guifei ^{[1
]}

Yuan, Boyu ^{[2
]}

Li, Liang ^{[1
]}

Wang, Chao ^{[1
,3
]}

机构：

[1] Jiangsu Normal Univ, Sch Chem & Chem Engn, Jiangsu Key Lab Green Synthet Chem Funct Mat, Xuzhou 221116, Peoples R China

[2] Jiangsu Normal Univ, Sch Phys & Elect Engn, Xuzhou 221116, Peoples R China

[3] Xuzhou Inst Technol, Xuzhou 221111, Peoples R China

来源：

ELECTROCHEMISTRY | 2016年 / 84卷 / 06期

关键词：

Copper; Polarization; Anodic Films; In-line Digital Holography; RING-DISK ELECTRODE; SULFURIC-ACID; PITTING CORROSION; DIFFUSION LAYER; NACL SOLUTION; BEHAVIOR; RECONSTRUCTION; PASSIVATION; CHLORIDE; STEEL;

D O I：

10.5796/electrochemistry.84.378

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The films formed on the surface of copper during its anodic dissolution in the neutral or acidic sulfate solution were studied with the in-line digital holography. The results showed that the mixture films were formed on the surface of copper in the neutral or acidic sulfate solution: the inner oxide film and the outer salt film. Although there are defects in the oxide film caused by the sulfate ions, the oxide film other than the salt film mainly inhibits the anodic dissolution at the high anodic potentials. (C) The Electrochemical Society of Japan, All rights reserved.

引用

页码：378 / 382

页数：5

共 25 条

[11] ANODIC POLARIZATION BEHAVIOR OF COPPER [J].