Determination of copper, nickel, sodium hydroxide, and formaldehyde in solutions for chemical copper plating

被引：0
|
作者：
Drozd, AV [1 ]
Per'kov, IG [1 ]
Artsebashev, GV [1 ]
Shibina, IV [1 ]
机构：
[1] Kharkov State Univ, UA-310077 Kharkov, Ukraine
来源：
INDUSTRIAL LABORATORY | 1997年 / 63卷 / 07期
关键词：
D O I：
暂无
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
A method for simultaneous photometric determination of copper, nickel, sodium hydroxide, and formaldehyde in tartrate solutions for copper plating is developed. The concentration of copper and nickel and the value of the pOH are found by solving a system of equations, and the content of formaldehyde is found from the decrease in the concentration of copper and nickel after introducing PdCl2 or AgNO3 destabilizer into the solution being analyzed. This method is rapid and may be used in an automatic mode for monitoring and correcting the composition of baths for chemical copper plating.
引用
收藏
页码：392 / 395
页数：4
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