Stress-induced martensite in NiTi corrugated films

被引：0

作者：

Wuttig, M ^{[1
]}

Slutsker, JS ^{[1
]}

Mori, K ^{[1
]}

Li, J ^{[1
]}

机构：

[1] Univ Maryland, Dept Mat Sci & Engn, College Pk, MD 20742 USA

来源：

MATERIALS OF SMART SYSTEMS III | 2000年 / 604卷

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Films deposited on corrugated surfaces develop non-uniform stresses when cooled from the deposition temperature. A disclination model shows that the stresses have rhombohedral and tetragonal components which can preferentially stress induce the martensite variants. The deflection of NiTi/Si bimorphs caused by the formation of martensite should thus be different if the NiTi/Si interface is corrugated or not. Experimental results confirm this expectation.

引用

页码：105 / 108

页数：4

共 18 条

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