Fabrication of high melting point joint using Sn-57Bi-1Ag low temperature lead-free solder and gold-plated electrode

被引：0

作者：

Maruya, Yuki ^{[1
]}

Hata, Hanae ^{[1
]}

Shohji, Ikuo ^{[1
]}

Koyama, Shinji ^{[1
]}

机构：

[1] Gunma Univ, Fac Sci & Technol, Kiryu, Gunma, Japan

来源：

2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2017年

关键词：

Sn-57Bi-1Ag; Lead-free solder; Diffusion; Aging; Au-Sn IMC; AU; CU;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Low temperature bonding of Au-electroplated Cu and Cu electrodes with Sn-57Bi-1Ag solder was examined. Longer bonding time gave a Au/Cu joint higher melting point. In the joint bonded at 170 degrees C for 1 min, a large scallop-shaped AuSn4 layer formed in the joint interface of Au and solder. A Au-diffused layer formed in the tip of the AuSn4 layer. The Sn-Cu-Au layer including approximately 20 mol% Au formed in the joint interface of Cu and solder. With increasing the bonding time, both the eutectic microstructure with beta-Sn and Bi and the Au layer disappeared. As the result, the solder area changed from the eutectic microstructure to Bi phases including AuSn4 and Ag3Sn phases in the bonding time over 30 min. The bond strength of the joint decreased with increasing the bonding time due to the fracture mode change. Aging treatment gave the effect same as increasing bonding time on melting properties and bond strength of the joint.

引用

页码：551 / 554

页数：4

共 12 条

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