Terahertz Band Interconnect Architecture for Future Chip-to-Chip Wireless Communication

被引：0
|
作者：
Elkarkraoui, Taieb [1 ]
Nezhad-Ahmadi, Mohammad-Reza [1 ]
Safavi-Naeini, Safieddin [1 ]
机构：
[1] Univ Waterloo, Dept Elect & Comp Engn, Waterloo, ON N2L 3G1, Canada
来源：
2020 45TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ) | 2020年
基金：
加拿大自然科学与工程研究理事会;
关键词：
D O I：
10.1109/IRMMW-THz46771.2020.9370693
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduces a new wireless chip-to-chip interconnection architecture based on two Vivaldi antennas operating at terahertz (THz) frequency range (250-300 GHz). Preliminary simulation results show that the free space transmission levels over a distance of d=5 mm are around -25 dB. In order to improve these values, we propose to modify the propagation channel characteristic by inserting a metallic strips array printed on thin dielectric substrate, utilizing this technique the transmission levels are remarkably improved to -6 dB over a large bandwidth (250 -300 GHz) which is 19 dB enhancement.
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页数：2
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