Terahertz Band Interconnect Architecture for Future Chip-to-Chip Wireless Communication

被引：0

作者：

Elkarkraoui, Taieb ^{[1
]}

Nezhad-Ahmadi, Mohammad-Reza ^{[1
]}

Safavi-Naeini, Safieddin ^{[1
]}

机构：

[1] Univ Waterloo, Dept Elect & Comp Engn, Waterloo, ON N2L 3G1, Canada

来源：

2020 45TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ) | 2020年

基金：

加拿大自然科学与工程研究理事会;

关键词：

D O I：

10.1109/IRMMW-THz46771.2020.9370693

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper introduces a new wireless chip-to-chip interconnection architecture based on two Vivaldi antennas operating at terahertz (THz) frequency range (250-300 GHz). Preliminary simulation results show that the free space transmission levels over a distance of d=5 mm are around -25 dB. In order to improve these values, we propose to modify the propagation channel characteristic by inserting a metallic strips array printed on thin dielectric substrate, utilizing this technique the transmission levels are remarkably improved to -6 dB over a large bandwidth (250 -300 GHz) which is 19 dB enhancement.

引用

页数：2

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