Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits

被引：72

作者：

Fukushima, T. ^{[1
]}

Iwata, E. ^{[1
]}

Konno, T. ^{[1
]}

Bea, J. -C. ^{[1
]}

Lee, K. -W. ^{[1
]}

Tanaka, T. ^{[2
]}

Koyanagi, M. ^{[1
]}

机构：

[1] Tohoku Univ, Dept Bioengn & Robot, Aoba Ku, Sendai, Miyagi 9808579, Japan

[2] Tohoku Univ, Med Nanosyst Engn Lab, Aoba Ku, Sendai, Miyagi 9808579, Japan

来源：

APPLIED PHYSICS LETTERS | 2010年 / 96卷 / 15期

关键词：

integrated circuit manufacture; self-assembly; wafer bonding;

D O I：

10.1063/1.3328098

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We have demonstrated fluidic chip self-assembly on Si wafers for fabricating three-dimensional integrated circuits. In this self-assembly technique, small droplets of hydrofluoric acid were employed to simultaneously align many millimeter-scale chips and directly bond them to the hydrophilic bonding areas formed on the host wafers by oxide-oxide bonding. The liquid surface tension enables many Si chips to be self-assembled with the highest alignment accuracy of 50 nm. In addition, many chips were tightly bonded to the hydrophilic bonding areas without applying a mechanical force after the liquid was evaporated at room temperature.

引用

页数：3

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