A novel integral formulation for the solution of Maxwell equations

被引：1

作者：

Rubinacci, G ^{[1
]}

Tamburrino, A ^{[1
]}

Villone, F ^{[1
]}

机构：

[1] Univ Cassino, DAEIMI, Lab Computat Electromagnet, I-03043 Cassino, Italy

来源：

IEEE TRANSACTIONS ON MAGNETICS | 2003年 / 39卷 / 03期

关键词：

electromagnetic compatibility; electromagnetic coupling; equivalent circuits; finite-element method; integral equations; interconnections;

D O I：

10.1109/TMAG.2003.810362

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a novel integral formulation for the solution of the full Maxwell equations in the frequency domain. The solenoidality of the current density inside a homogeneous conductor is exploited to introduce a two-component electric vector potential, which is numerically expanded in terms of edge elements.

引用

页码：1578 / 1581

页数：4

共 9 条

[1] INTEGRAL FORMULATION FOR 3D EDDY-CURRENT COMPUTATION USING EDGE ELEMENTS
ALBANESE, R
RUBINACCI, G
[J]. IEE PROCEEDINGS-A-SCIENCE MEASUREMENT AND TECHNOLOGY, 1988, 135 (07): : 457 - 462
[2] Albanese R, 1998, ADV IMAG ELECT PHYS, V102, P1
[3] LANDAU L, 1971, ELECTRODYNAMIQUE MIL
[4] MAFFUCCI A, 2002, P SPI WORKSHOP LUCCA
[5] Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes
Rong, AS
Cangellaris, AC
[J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2001, : 225 - 228
[6] Fast computational methods for large-scale eddy-current computation
Rubinacci, G
Tamburrino, A
Ventre, S
Villone, F
[J]. IEEE TRANSACTIONS ON MAGNETICS, 2002, 38 (02) : 529 - 532
[7] Progress in the methodologies for the electrical modeling of interconnects and electronic packages
Ruehli, AE
Cangellaris, AC
[J]. PROCEEDINGS OF THE IEEE, 2001, 89 (05) : 740 - 771
[8] EQUIVALENT CIRCUIT MODELS FOR 3-DIMENSIONAL MULTICONDUCTOR SYSTEMS
RUEHLI, AE
[J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1974, TT22 (03) : 216 - 221
[9] RUEHLI AE, 1999, IEEE INT S ELECTROMA, V2, P728

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