Electroless deposition (ED) of copper coating on micron-sized SiC particles

被引：22

作者：

Khosroshahi, N. Beigi ^{[1
]}

Khosroshahi, R. Azari ^{[1
]}

Mousavian, R. Taherzadeh ^{[2
]}

Brabazon, D. ^{[3
]}

机构：

[1] Sahand Univ Technol, Fac Mat Engn, East Azerbaijan, Iran

[2] Islamic Azad Univ, Zanjan Branch, Dept Met, Zanjan, Iran

[3] Dublin City Univ, Sch Mech & Mfg Engn, Adv Proc Technol Res Ctr, Dublin 9, Ireland

来源：

SURFACE ENGINEERING | 2014年 / 30卷 / 10期

关键词：

Copper; Electroless; Composites; SiC; Particles; BORON-CARBIDE PARTICLES; NANOPARTICLES; COMPOSITES; CERAMICS; ALUMINUM; POWDERS; ALLOY;

D O I：

10.1179/1743294414Y.0000000335

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The metallic coating of ceramic particles is a useful technique in order to promote reinforcement bonding with the matrix alloy. The possibility of formation of a uniform electroless deposition (ED) of copper on micron-sized SiC particles was investigated in this study. The effects of ED parameters, SiC particle size and morphology on the coating characteristics, and mechanical bonding (adhesion) at the SiC/copper interface were studied. The results indicated that etching pre-treatment was very effective for improvement of mechanical bonding at the interface. Optimised values of bath temperature and pH were determined as 60 degrees C and 10 respectively. The best results were obtained for SiC particles with a smaller average particle size of 10 mu m in comparison with coarser 80 mu m sized particles. Some dissolution of the copper coating was noted after stir casting the particles into a semi-solid aluminium matrix.

引用

页码：747 / 751

页数：5

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