共 18 条
[1]
[Anonymous], 2018 IEEE 68 EL COMP
[2]
Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging
[J].
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC),
2016,
:1879-1885
[3]
Das S., 2004, ISPD 04, P108, DOI DOI 10.1145/981066.981091
[6]
Jain P, 2010, THREE-DIMENSIONAL INTEGRATED CIRCUIT DESIGN, P33, DOI 10.1007/978-1-4419-0784-4_3
[7]
Jun H, 2017, IEEE INT MEM WORKSH, P99
[8]
Liu Y, 2012, INT CONF MANIP MANU, P14, DOI 10.1109/3M-NANO.2012.6473002
[9]
Embedded Multi-Die Interconnect Bridge (EMIB) - A High Density, High Bandwidth Packaging Interconnect
[J].
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC),
2016,
:557-565
[10]
Integrated Copper Heat Spreaders in Glass Panel Embedded Packages with Near-Zero Thermal Interface Resistance
[J].
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018),
2018,
:2013-2018