Uniformity investigation of pHEMTs in 3-D MMICs for pre and post multilayer fabrication

被引:4
作者
Alim, Mohammad A. [1 ]
Begum, T. [1 ]
Rezazadeh, Ali A. [2 ]
机构
[1] Univ Chittagong, Elect & Elect Engn, Chittagong, Bangladesh
[2] Univ Manchester, Microwave & Commun Syst Res Grp, Manchester, Lancs, England
关键词
3-D MMICs; pHEMTs; Pre-and post-multilayer fabrication; Uniformity test; Characterization; Analysis; TRANSMISSION-LINES; TRANSISTORS;
D O I
10.1016/j.sse.2019.107685
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study deals with the uniformity investigation and comparison on the typical behaviour of pseudomorphic high electron mobility transistors (pHEMTs) before and after the 3-D multilayer fabrication. There are seven multilayer fabricated pHEMTs compared with the seven virgin pHEMTs based on drain-source input current, output current, transconductance, off state leakage behaviour, threshold voltage, knee voltage, on-resistance, Schottky barrier height, ideally factor, reverse saturation current, small signal gain and current gain. Below 10% changes in performance can be seen after multilayer fabrication compare to virgin samples and apart from these exceptions, the discrepancies are well within the tolerance and less than 3% in terms of Schottky behaviour. We show that, the application of the 3D-MMIC technology does not cause any visible destruction of pHEMTs performance using seven different samples before and after the multilayer fabrication.
引用
收藏
页数:7
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