Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

被引：16

作者：

Nobari, Amir Hossein ^{[1
]}

Maalekian, Mehran ^{[2
]}

Seelig, Karl ^{[2
]}

Pekguleryuz, Mihriban ^{[1
]}

机构：

[1] McGill Univ, Dept Min & Mat Engn, Montreal, PQ, Canada

[2] AIM Met & Alloys LP, Dept Res & Dev, Montreal, PQ, Canada

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2017年 / 46卷 / 07期

关键词：

Lead-free solder; solderability; melting; wetting balance; contact angle; fluidity; wave soldering; ALLOYS; JOINTS; BEHAVIOR; SB;

D O I：

10.1007/s11664-016-5181-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study, the effects of Ag, Ni and Bi additions on the melting, solidification, fluidity and wetting behavior of Sn-0.7Cu base solder alloy are studied. The addition of a small amount of Ni reduces the undercooling and improves the feeding distance (fluidity length); however, Ni does not improve the wetting and the spreading performance. The effect of Ni on the fluidity length of Ag-containing Sn-0.7Cu (SAC alloy) is marginal. Bi and Ag both improve wetting performance and also lower the melting temperature; however, they do not improve the fluidity; instead, they reduce the maximum length of fluidity.

引用

页码：4076 / 4084

页数：9

共 24 条

[1] Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al [J].

Boesenberg, Adam J. ;

Anderson, Iver E. ;

Harringa, Joel L. .

JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (07) :1868-1881

[2] The effect of an electric current on rod-eutectic solidification in Sn-0.9 wt.% Cu alloys [J].

Brush, LN ;

Grugel, RN .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1997, 238 (01) :176-181

[3] Enhancing mechanical response of hypoeutectic Sn-6.5Zn solder alloy using Ni and Sb additions [J].

El-Daly, A. A. ;

Hammad, A. E. ;

Al-Ganainy, G. A. ;

Ibrahiem, A. A. .

MATERIALS & DESIGN, 2013, 52 :966-973

[4]

Evans JW, 2007, GUIDE LEAD FREE SOLD

[5]

Felberbaum M., 2014, JOM, V63, P52

[6] The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys [J].

Gourlay, C. M. ;

Read, J. ;

Nogita, K. ;

Dahle, A. K. .

JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (01) :51-60

[7]

Laentzsch M, 2006, ESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings, P383

[8]

Lee T.-K.:., 2015, Fundamentals of lead-free solder interconnect technology: From microstructures to reliability

[9]

Maalekian M., 2016, SMT TODAY FEB, P52

[10]

Murr L., 1975, INTERFACIAL PHENOMEN

← 1 2 3 →