Studies of electroless Ni-Co-P ternary alloy on glass fibers

被引:59
作者
Huang, Ying [1 ]
Shi, Ke
Liao, Zijun
Wang, Yanli
Wang, Li
Zhu, Feng
机构
[1] Northwestern Polytech Univ, Dept Appl Chem, Xian 710072, Peoples R China
[2] Logist Engn Univ, PLA, Mil Oil Applicat & Management Engn Dept, Chongqing 400016, Peoples R China
关键词
electroless plating; Ni-Co-P; glass fiber; structure; crystallization;
D O I
10.1016/j.matlet.2006.07.122
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Electroless Ni-Co-P alloys on glass fibers with sodium hypophophite as a reducing agent and sodium citrate as a complexing agent in an alkaline bath was studied. A kind of silane coupling agent was used during its pretreatmeat. Plating rate was determined by measuring the weight of glass fibers after plating. The effect of deposition parameters, such as mole ratios of CoSO4/(COSO4+NiSO4) and pH, on the composition and the plating rate of the deposits were examined. The crystallization behavior of Ni-Co-P alloys was studied by using differential scanning colorimetry (DSC) and X-ray diffraction (XRD). It was found that all of the three exothermic peaks in DSC curves alter distinctly as the mole ratios of CoSO4/(CoSO4+NiSO4) increase. When the concentration of sodium hypophophite is not below 16 g l(-1) in the plating bath, the structure of the as-plated Ni-Co-P alloys plated at all conditions is amorphous. The deposit transformed into Ni5P2 and Ni12P5 phase after heat treatment at 300 degrees C and 420 degrees C, but they disappear and stable Ni3P appeared after sintering at 480 degrees C. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:1742 / 1746
页数:5
相关论文
共 16 条
[1]   Ferrite plating:: a chemical method preparing oxide magnetic films at 24-100°C, and its applications [J].
Abe, M .
ELECTROCHIMICA ACTA, 2000, 45 (20) :3337-3343
[2]   Electroless deposition of Ni-Cu-P, Ni-W-P and Ni-W-Cu-P alloys [J].
Balaraju, JN ;
Rajam, KS .
SURFACE & COATINGS TECHNOLOGY, 2005, 195 (2-3) :154-161
[3]   Ni-Zn-P alloy deposition from sulfate bath: inhibitory effect of zinc [J].
Bouanani, M ;
Cherkaoui, F ;
Cherkaoui, M ;
Belcadi, S ;
Fratesi, R ;
Roventi, G .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1999, 29 (10) :1171-1176
[4]   Electroless nickel plating on silicon carbide nanoparticles [J].
Chen, YJ ;
Cao, MS ;
Xu, Q ;
Zhu, J .
SURFACE & COATINGS TECHNOLOGY, 2003, 172 (01) :90-94
[5]  
Hagiwara K, 1997, PLAT SURF FINISH, V84, P74
[6]   A study on growth processes of CoNiP perpendicular magnetic anisotropy films electroless-deposited at room temperature [J].
Homma, T ;
Sezai, Y ;
Osaka, T .
ELECTROCHIMICA ACTA, 1997, 42 (20-22) :3041-3047
[7]   Effect of deposition site condition on the initial growth process of electroless CoNiP films [J].
Itakura, K ;
Homma, T ;
Osaka, T .
ELECTROCHIMICA ACTA, 1999, 44 (21-22) :3707-3711
[8]   The evolution of texture during annealing of electroless Ni-Co-P deposits [J].
Lee, DN ;
Hur, KH .
SCRIPTA MATERIALIA, 1999, 40 (12) :1333-1339
[9]  
Li J, 1996, PLAT SURF FINISH, V83, P62
[10]   Preparation of anisotropic conductive fine particles by electroless nickel plating [J].
Motizuki, I ;
Izawa, K ;
Watanabe, J ;
Honma, H .
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1999, 77 :41-43