Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

被引：18

作者：

Kim, Su-Hyeon ^{[1
]}

Kang, Joo-Hee ^{[1
]}

Han, Seung Zeon ^{[1
]}

机构：

[1] Korea Inst Mat Sci, Chang Won 641831, Gyeongnam, South Korea

来源：

MATERIALS TRANSACTIONS | 2010年 / 51卷 / 04期

关键词：

electron backscatter diffraction; copper film; columnar grain structure; high-angle grain boundary; twin boundary; annealing; grain growth; annealing twinning; ABNORMAL GRAIN-GROWTH; TEXTURE EVOLUTION; IN-SITU; ANISOTROPY; KINETICS;

D O I：

10.2320/matertrans.MG200910

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The microstructure evolution of electroplated copper films was characterized by electron backscatter diffraction (EBSD). Special care was taken during the preparation of the cross-sectional specimens and microstructure analysis to obtain reliable results. The film exhibited a columnar grain structure with a large fraction of twin boundaries. Annealing induced normal grain growth and caused many of the general high-angle grain boundaries to be replaced by twin boundaries, possibly by annealing twinning. [doi:10.2320/matertrans.MG200910]

引用

页码：659 / 663

页数：5

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