Piezoresistive and self-actuated 128-cantilever arrays for nanotechnology applications

被引：38

作者：

Rangelow, I. W.

Ivanov, Tzv.

Ivanova, K.

Volland, B. E.

Grabiec, P.

Sarov, Y.

Persaud, A.

Gotszalk, T.

Zawierucha, P.

Zielony, M.

Dontzov, D.

Schmidt, B.

Zier, M.

Nikolov, N.

Kostic, I.

Engl, W.

Sulzbach, T.

Mielczarski, J.

Kolb, S.

Latimier, Du P.

Pedreau, R.

Djakov, V.

Huq, S. E.

Edinger, K.

Fortagne, O.

Almansa, A.

Blom, H. O.

机构：

[1] Tech Univ Ilmenau, FEI, IMNE, MNES, D-98684 Ilmenau, Germany

[2] Univ Kassel, Inst Nanostruct Technol & Analyt, INA, D-34109 Kassel, Germany

[3] Wroclaw Tech Univ, Fac Mikrosyst Elect & Photon, PL-50372 Wroclaw, Poland

[4] SIOS Messtech Gmb, SIOS GmbH, D-98693 Ilmenau, Germany

[5] Rossendorf Inc, Forschungszentrum Rossendorf EV, Inst Ion Beam Phys & Mat Res, D-01314 Dresden, Germany

[6] Microsyst Ltd, Varna, Bulgaria

[7] Slovak Acad Sci, Bratislava 84226, Slovakia

[8] Nanoworld Serv GmbH, D-91058 Erlangen, Germany

[9] CNRS, INPL, LEM, UMR 7569, F-54501 Vandoeuvre Les Nancy, France

[10] Infineon Technol AG, D-81726 Munich, Germany

[11] CNRS, INPL, IDMOS, F-33170 Gradignan, France

[12] Rutherford Appleton Lab, Cent Microstruct Facil, CCLRC, Didcot OX11 0QX, Oxon, England

[13] NaWoTec GmbH, Zeiss SMT, D-64380 Rossdorf, Germany

[14] Vistec Electron Beam GmbH, D-07745 Jena, Germany

[15] ARC Seibersdorf Res GmbH, Mechatron Automat Syst, A-2444 Seibersdorf, Austria

[16] Uppsala Univ, Angstrom Lab, SE-75121 Uppsala, Sweden

来源：

MICROELECTRONIC ENGINEERING | 2007年 / 84卷 / 5-8期

关键词：

piezoresistive micro-cantilever; self-actuated micro-cantilever; cantilever arrays;

D O I：

10.1016/j.mee.2007.01.219

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A major limitation for future nanotechnology, particularly for bottom-up manufacturing is the non-availability of 2-dimensional massively parallel probe arrays. Scanning proximity probes are uniquely powerful tools for analysis, manipulation and bottom-up synthesis: they are capable of addressing and engineering surfaces at the atomic level and are the key to unlocking the full potential of Nanotechnology. Generic massively parallel intelligent cantilever-probe platforms is demonstrated through a number of existing and ground-breaking techniques. A packaged VLSI NEMS-chip (Very Large Scale Integrated Nano Electro Mechanical System) incorporating 128 proximal probes, fully addressable with control and readout interconnects and advanced software will be presented. (c) 2007 Published by Elsevier B.V.

引用

页码：1260 / 1264

页数：5

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