Mechanical properties of and critical conditions for crack initiation in electronic glass

被引:0
|
作者
Sun, Ya Zhou [1 ]
Zhang, Jing [1 ]
Liu, Hai Tao [1 ]
机构
[1] Harbin Inst Technol, Sch Mech Engn, Harbin 150001, Peoples R China
基金
中国国家自然科学基金;
关键词
SOLDER ALLOYS; TEMPERATURE; NANOINDENTATION; MICROHARDNESS; BEHAVIOR; LOAD;
D O I
10.1007/s10854-014-2189-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the mechanical properties of electronic glass are tested using a combination of the Vickers indentation test and a multiple-loading nanoindentation test to obtain the elastic modulus, Poisson's ratio and hardness values. The basic mechanical property parameters of the electronic glass and its stress-strain curve are found using atomic force microscopy analysis of the indentation morphology. The critical pressure and depth for crack initiation and the corresponding load and depth can be obtained during vertical loading on the electronic glass. When cracks extend to the surface, the results show that the electronic glass is isotropic. Several loading cycles causes a fatigue effect on the surface of the electronic glass, which decreases its elastic-plastic response. While the loadings are increasing, the elastic-plastic response rates are decreasing bur it rends stability finally. These results can provide a reference and guide for micro machining and surface microstructure machining of electronic glass.
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页码:4466 / 4475
页数:10
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