Closed-form expressions for the line-coupling parameters of coupled on-chip interconnects on lossy silicon substrate

In this paper, novel and accurate closed-form expressions are proposed which represent the per-unit-length line-coupling parameters (mutual impedance and mutual admittance) of coupled on-chip microstrip interconnects on lossy silicon substrate. The frequency-dependent mutual admittance is accurately expressed in the fully closed form, based on a conformal mapping approach, while the frequency-dependent mutual impedance is described by a very simple formula associated with a complex image method. The closed-form expressions are shown to be in good agreement with the full-wave solutions, and thus can be implanted into the multiconductor transmission-line (MTL) equations for modeling silicon-based integrated circuits. (C) 2004 Wiley Periodicals, Inc.