Editorial: Dielectric Ceramics for Electronic Applications

被引:3
作者
Bai, Yang [1 ]
Varghese, Jobin [2 ]
Sebastian, Mailadil Thomas [3 ]
机构
[1] Univ Oulu, Fac Informat Technol & Elect Engn, Microelect Res Unit, Oulu, Finland
[2] Fraunhofer IKTS, LTCC & HTCC, Dept Hybrid Microsyst, Dresden, Germany
[3] Natl Inst Interdisciplinary Sci & Technol CSIR, Thiruvananthapuram, Kerala, India
关键词
dielectric; piezoelectric; cold sintering; upside-down composite; room-temperature densification; photo-piezoelectric;
D O I
10.3389/fmats.2021.714522
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页数:3
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