Laser precision engineering of glass substrates

被引：18
作者：
Lan, B
Hong, MH
Ye, KD
Wang, ZB
Cheng, SX
Chong, TC
机构：
[1] Data Storage Inst, Singapore 117608, Singapore
[2] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore
来源：
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2004年 / 43卷 / 10期
关键词：
laser ablation; glass; pocket scanning method; cracks; ablation depth;
D O I：
10.1143/JJAP.43.7102
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
The precise laser microfabrication of glass is a very challenging task due to the stress-induced microcracks generated during laser ablation. In this paper, the results of high-quality glass microfabrication by low-energy NANAG laser (355 nm, 30 ns) ablation and pocket scanning are presented. Pocket scanning involves the scanning of a laser beam along parallel overlapped paths with the last path forming structural edge, while conventional direct scanning involves the scanning of a beam just along single path to obtain the structure edge. It is found that cracks that formed around the edges by pocket scanning are significantly reduced in size compared with those formed by laser direct scanning. Minimum crack sizes of less than 10 mum have been obtained at optimized parameters. Ablation depth. is also enhanced greatly by pocket scanning; it increases almost linearly with laser fluence and the number of scanning loops. There is no saturation of ablation depth as observed in laser direct scanning. This technique has high potential applications in glass precision engineering.
引用
收藏
页码：7102 / 7106
页数：5
相关论文
共 14 条
[1]   Powder blasting for three-dimensional microstructuring of glass [J].
Belloy, E ;
Sayah, A ;
Gijs, MAM .
SENSORS AND ACTUATORS A-PHYSICAL, 2000, 86 (03) :231-237
[2]   The introduction of powder blasting for sensor and microsystem applications [J].
Belloy, E ;
Thurre, S ;
Walckiers, E ;
Sayah, A ;
Gijs, MAM .
SENSORS AND ACTUATORS A-PHYSICAL, 2000, 84 (03) :330-337
[3]   CONTROLLED ETCHING OF SILICATE-GLASSES BY PULSED ULTRAVIOLET-LASER RADIATION [J].
BRAREN, B ;
SRINIVASAN, R .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1988, 6 (02) :537-541
[4]   Processing applications with the 157-nm fluorine excimer laser [J].
Herman, PR ;
Beckley, K ;
Jackson, B ;
Kurosawa, K ;
Moore, D ;
Yamanishi, T ;
Yang, JH .
EXCIMER LASERS, OPTICS, AND APPLICATIONS, 1997, 2992 :86-95
[5]   The interaction of femtosecond and nanosecond laser pulses with the surface of glass [J].
Kasaai, MR ;
Kacham, V ;
Theberge, F ;
Chin, SL .
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2003, 319 (1-2) :129-135
[6]   Far-field and near-field material processing with femtosecond laser pulses [J].
Korte, F ;
Nolte, S ;
Chichkov, BN ;
Bauer, T ;
Kamlage, G ;
Wagner, T ;
Fallnich, C ;
Welling, H .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1999, 69 :S7-S11
[7]   Precision laser ablation of dielectrics in the 10-fs regime [J].
Lenzner, M ;
Krüger, J ;
Kautek, W ;
Krausz, F .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1999, 68 (03) :369-371
[8]   Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components [J].
Markillie, GAJ ;
Baker, HJ ;
Villarreal, FJ ;
Hall, DR .
APPLIED OPTICS, 2002, 41 (27) :5660-5667
[9]   Femtosecond- and nanosecond-pulse laser ablation of bariumalumoborosilicate glass [J].
Rudolph, P ;
Bonse, J ;
Krüger, J ;
Kautek, W .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1999, 69 (Suppl 1) :S763-S766
[10]   LASER-INDUCED DAMAGE IN DIELECTRICS WITH NANOSECOND TO SUBPICOSECOND PULSES [J].
STUART, BC ;
FEIT, MD ;
RUBENCHIK, AM ;
SHORE, BW ;
PERRY, MD .
PHYSICAL REVIEW LETTERS, 1995, 74 (12) :2248-2251
12