Analysis of microstructure formation in gas-atomised Al-12 wt.% Sn-1 wt.% Cu alloy powder

被引:13
作者
Kong, C. J. [1 ]
Brown, P. D. [1 ]
Harris, S. J. [1 ]
McCartney, D. G. [1 ]
机构
[1] Univ Nottingham, Sch Mech Mat & Mfg Engn, Nottingham NG7 2RD, England
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2007年 / 454卷
基金
英国工程与自然科学研究理事会;
关键词
rapid solidification; microstructure; aluminium-tin; undercooling; phase separation;
D O I
10.1016/j.msea.2006.11.050
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The microstructure of gas-atomised Al-12 wt.% Sn-1 wt.% Cu alloy powder has been investigated using scanning and transmission electron microscopy. Powder particles above approximately 8 mu m in diameter exhibited a cellular-dendritic solidification morphology comprising alpha-Al dendrites and interdendritic Sn. In smaller powder particles, with diameters less than approximately 8 mu m, the microstructure comprised an alpha-Al matrix with a dispersion of sub-micron Sn particles. The size of the dispersed Sn phase decreased with decreasing powder size (i.e. increased cooling rate). The formation of this dispersed phase microstructure is explained by the existence of a metastable liquid-phase miscibility gap in the system such that the reaction L --> L-1 + L-2 occurred prior to the onset of solidification in particles below 8 mu m in size. A heat transfer analysis was used to estimate the undercooling for the nucleation of alpha-Al in droplets cooled at different rates. The nucleation undercooling predicted for an 8 mu m diameter droplet was 260 K and this represents a critical value which must be exceeded to enter the immiscibility region. The above value is in reasonable agreement with the temperature of the metastable immiscibility boundary, calculated from thermodynamic data, which occurs at an undercooling of approximately 280 K for Al-12 wt.% Sn. (C) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:252 / 259
页数:8
相关论文
共 31 条
  • [1] ADKINS NJE, 1991, MATER SCI TECH SER, V7, P334, DOI 10.1179/026708391790183286
  • [2] DRAGGING OF SMALL OXIDE PARTICLES BY MIGRATING GRAIN BOUNDARIES IN COPPER
    ASHBY, MF
    CENTAMORE, RM
    [J]. ACTA METALLURGICA, 1968, 16 (09): : 1081 - +
  • [3] Rapid solidification of Cu84Co16 alloy undercooled into the metastable miscibility gap under different conditions
    Cao, CD
    Herlach, DM
    Kolbe, M
    Görler, GP
    Wei, B
    [J]. SCRIPTA MATERIALIA, 2003, 48 (01) : 5 - 9
  • [4] FORMATION OF BANDS OF ULTRAFINE BERYLLIUM PARTICLES DURING RAPID SOLIDIFICATION OF AL-BE ALLOYS - MODELING AND DIRECT OBSERVATIONS
    ELMER, JW
    AZIZ, MJ
    TANNER, LE
    SMITH, PM
    WALL, MA
    [J]. ACTA METALLURGICA ET MATERIALIA, 1994, 42 (04): : 1065 - 1080
  • [5] Production of ultrafine microstructures in Al-Sn, Al-Sn-Cu and Al-Sn-Cu-Si alloys for use in tribological applications
    Harris, SJ
    McCartney, DG
    Horlock, AJ
    Perrin, C
    [J]. ALUMINIUM ALLOYS: THEIR PHYSICAL AND MECHANICAL PROPERTIES, PTS 1-3, 2000, 331-3 : 519 - 525
  • [6] HIGH-RESOLUTION ELECTRON-MICROSCOPY OF RAPIDLY QUENCHED AL-SN ALLOY
    ICHINOSE, H
    ISHIDA, Y
    [J]. SCRIPTA METALLURGICA, 1985, 19 (01): : 5 - 9
  • [7] Jones H., 1982, RAPID SOLIDIFICATION
  • [8] SOLIDIFICATION OF TIN DROPLETS EMBEDDED IN AN ALUMINUM MATRIX
    KIM, WT
    CANTOR, B
    [J]. JOURNAL OF MATERIALS SCIENCE, 1991, 26 (11) : 2868 - 2878
  • [9] MICROSTRUCTURE OF RAPIDLY SOLIDIFIED ALUMINUM-BASED IMMISCIBLE ALLOYS
    KIM, WT
    ZHANG, DL
    CANTOR, B
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1991, 134 : 1133 - 1138
  • [10] The microstructures of a thermally sprayed and heat treated Al-20 wt.%Sn-3 wt.%Si alloy
    Kong, CJ
    Brown, PD
    Harris, SJ
    McCartney, DG
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 403 (1-2): : 205 - 214