Co-packaged datacenter optics: Opportunities and challenges

被引:133
作者
Minkenberg, Cyriel [1 ]
Krishnaswamy, Rajagopal [2 ]
Zilkie, Aaron [3 ]
Nelson, David [3 ]
机构
[1] Rockley Photon Ltd, 57 Woodstock Rd, Oxford OX2 6HJ, England
[2] Rockley Photon Inc, San Jose, CA USA
[3] Rockley Photon Inc, Pasadena, CA USA
关键词
PHOTONIC INTEGRATION; SILICON; PLATFORMS;
D O I
10.1049/ote2.12020
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High-capacity, high-density, power-, and cost-efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co-packaged optics? Herein, we aim to shed light on the trade-offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture.
引用
收藏
页码:77 / 91
页数:15
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