Analysis of heat transfer performance and vapor-liquid meniscus shape of ultra-thin vapor chamber with supporting columns

被引:35
作者
Li, Deqiang [1 ]
Huang, Zhe [1 ]
Zhao, Jing [1 ]
Jian, Qifei [1 ]
Chen, Yangyang [1 ]
机构
[1] South China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510641, Peoples R China
关键词
Theoretical analysis model; Ultra-thin vapor chamber; Supporting columns; Meniscus; Heat transfer limit; TIP CLEARANCE; PIPES; MODEL;
D O I
10.1016/j.applthermaleng.2021.117001
中图分类号
O414.1 [热力学];
学科分类号
摘要
Establishing the theoretical analysis model of vapor chamber is helpful to predict its heat transfer performance. It provides a valuable reference for heat transfer enhancement and structural design of ultra-thin vapor chamber (UTVC). In this paper, a theoretical analysis model of ultra-thin vapor chamber with supporting columns is established. This model considers the influence of supporting columns on vapor flow and the Marangoni effect on liquid flow and gives the analytical solution of temperature distribution and heat transfer limit of the UTVC. The accuracy of the model is verified by experiments. Compared with the experimental results, the maximum error of theoretical heat transfer limit is less than 10%. The meniscus shape under different heating power is displayed. The effects of key parameters such as the vapor space thickness, wick thickness, and the supporting columns arrangement on the heat transfer performance of the UTVC are analyzed. According to the theoretical analysis model, the critical thickness of vapor space is 0.3 mm. Thinning the wick thickness improves the uniformity of temperature. In addition, reducing the number of supporting columns on the flow section can effectively improve the heat transfer limit of UTVC.
引用
收藏
页数:15
相关论文
共 29 条
[1]   Analysis of flat heat pipes with various heating and cooling configurations [J].
Aghvami, Maziar ;
Faghri, Amir .
APPLIED THERMAL ENGINEERING, 2011, 31 (14-15) :2645-2655
[2]   Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices [J].
Ahamed, Mohammad Shahed ;
Saito, Yuji ;
Mashiko, Koichi ;
Mochizuki, Masataka .
HEAT AND MASS TRANSFER, 2017, 53 (11) :3241-3247
[3]   A review of small heat pipes for electronics [J].
Chen, Xianping ;
Ye, Huaiyu ;
Fan, Xuejun ;
Ren, Tianling ;
Zhang, Guoqi .
APPLIED THERMAL ENGINEERING, 2016, 96 :1-17
[4]   A mathematical model for analyzing the thermal characteristics of a flat micro heat pipe with a grooved wick [J].
Do, Kyu Hyung ;
Kim, Sung Jin ;
Garimella, Suresh V. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2008, 51 (19-20) :4637-4650
[5]   3D transient model of vapour chamber: Effect of nanofluids on its performance [J].
Hassan, Hamdy ;
Harmand, Souad .
APPLIED THERMAL ENGINEERING, 2013, 51 (1-2) :1191-1201
[6]   Research and optimization design of limited internal cavity of ultra-thin vapor chamber [J].
Huang, Guangwen ;
Liu, Wangyu ;
Luo, Yuanqiang ;
Deng, Tao ;
Li, Yong ;
Chen, Hanyin .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2020, 148
[7]  
Kaviany M., 2012, MECH ENG ING SERIES
[8]   Coupled thermal and hydrodynamic models of flat micro heat pipes for the cooling of multiple electronic components [J].
Lefèvre, F ;
Lallemand, M .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2006, 49 (7-8) :1375-1383
[9]  
Li Y., 2020, ENERG FUEL
[10]  
Lim E., 2020, INT J NUMERICAL METH