Modeling of Electrostatic Chuck and Simulation of Electrostatic Force

被引：4

作者：

Wang, Xingkuo ^{[1
]}

Cheng, Jia ^{[2
]}

Wang, Kesheng ^{[2
,3
]}

Yang, Yiyong ^{[1
]}

Sun, Yuchun ^{[2
]}

Cao, Minglu ^{[2
]}

Han, Chuankun ^{[1
]}

Ji, Linhong ^{[2
]}

机构：

[1] China Univ Geosci, Sch Engn & Technol, Beijing 100083, Peoples R China

[2] Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China

[3] Acad Armored Force Engn PLA, Dept Mech Engn, Beijing 100072, Peoples R China

来源：

SENSORS, MECHATRONICS AND AUTOMATION | 2014年 / 511-512卷

关键词：

Electrostatic Chuck (ESC); Electrostatic Force; COMSOL; Modeling; Simulation; LAYER;

D O I：

10.4028/www.scientific.net/AMM.511-512.588

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Electrostatic chuck (ESC) is one of the key components in IC manufacturing process, which applies the principle of electrostatic adsorption to clamp the wafer on its surface. In such a system, electrostatic force is considered as one of the most important indicators. The method of modeling and simulation of electrostatic force by COMSOL software is proposed, and the accurateness is validated by comparing the results with those from reference. Then, the simulation of ESC in real manufacturing process is finished using the above method, which focuses on the effects of dielectric materials and voltage on electrostatic force. The research can offer references for the design of ESC, and it has significance to reduce experimental cost and improve the reliability of the equipment.

引用

页码：588 / +

页数：3

共 9 条

[1] ELECTROSTATIC CLAMPING APPLIED TO SEMICONDUCTOR PLASMA PROCESSING .2. EXPERIMENTAL RESULTS
DAVIET, JF
PECCOUD, L
MONDON, F
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1993, 140 (11) : 3256 - 3261
[2] ELECTROSTATIC CLAMPING APPLIED TO SEMICONDUCTOR PLASMA PROCESSING .1. THEORETICAL MODELING
DAVIET, JF
PECCOUD, L
MONDON, F
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1993, 140 (11) : 3245 - 3256
[3] Huang X.Q., 1995, COLL PHYS, V14, P9
[4] Jeonghoon Yoo, 2007, International Conference on Electrical Machines and Systems 2007, P1371
[5] Techniques to measure force uniformity of electrostatic chucks for EUV mask clamping
Veeraraghavan, Sathish
Sohn, Jaewoong
Turner, Kevin T.
[J]. PHOTOMASK TECHNOLOGY 2007, PTS 1-3, 2007, 6730
[6] ELECTROSTATIC CHARGE-DISTRIBUTION IN THE DIELECTRIC LAYER OF ALUMINA ELECTROSTATIC CHUCK
WATANABE, T
KITABAYASHI, T
NAKAYAMA, C
[J]. JOURNAL OF MATERIALS SCIENCE, 1994, 29 (13) : 3510 - 3516
[7] MANUFACTURING ISSUES OF ELECTROSTATIC CHUCKS
WRIGHT, DR
CHEN, L
FEDERLIN, P
FORBES, K
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1995, 13 (04): : 1910 - 1916
[8] Yatsuzuka K, 2001, IEEE IND APPLIC SOC, P399, DOI 10.1109/IAS.2001.955451
[9] Fundamental characteristics of electrostatic wafer chuck with insulating sealant
Yatsuzuka, K
Hatakeyama, F
Asano, K
Aonuma, S
[J]. IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2000, 36 (02) : 510 - 516

← 1 →