Passive thermal management system for downhole electronics in harsh thermal environments

被引：89

作者：

Shang, Bofeng ^{[1
]}

Ma, Yupu ^{[1
]}

Hu, Run ^{[1
]}

Yuan, Chao ^{[1
]}

Hu, Jinyan ^{[1
]}

Luo, Xiaobing ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, State Key Lab Coal Combust, Sch Energy & Power Engn, Wuhan 430074, Peoples R China

来源：

APPLIED THERMAL ENGINEERING | 2017年 / 118卷

基金：

中国国家自然科学基金;

关键词：

Downhole electronics; Harsh thermal environment; Passive thermal management system; Thermal insulation; Thermal storage; TEMPERATURE; COMPOSITES; DEVICES; PCM;

D O I：

10.1016/j.applthermaleng.2017.01.118

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The performance and reliability of downhole electronics will degrade in high temperature environments. Various active cooling techniques have been proposed for thermal management of such systems. However, these techniques require additional power input, cooling liquids and other moving components which complicate the system. This study presents a passive Thermal Management System (TMS) for downhole electronics. The TMS includes a vacuum flask, Phase Change Material (PCM) and heat pipes. The thermal characteristics of the TMS is evaluated experimentally. The results show that the system maintains equipment temperatures below 125 degrees C for a six-hour operating period in a 200 degrees C downhole environment, which will effectively protect the downhole electronics. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：593 / 599

页数：7

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