Single- and Multiple-Event Induced Upsets in HfO2/Hf 1T1R RRAM

被引:35
作者
Bennett, William G. [1 ]
Hooten, Nicholas C. [1 ]
Schrimpf, Ronald D. [1 ]
Reed, Robert A. [1 ]
Mendenhall, Marcus H. [1 ]
Alles, Michael L. [1 ]
Bi, Jinshun [1 ]
Zhang, En Xia [1 ]
Linten, Dimitri [2 ]
Jurzak, Malgorzata [2 ]
Fantini, Andrea [2 ]
机构
[1] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37212 USA
[2] IMEC, B-3001 Leuven, Belgium
关键词
Cross section; heavy ion; Hf; HfO2; multiple event upset; RESET; resistive random access memory (RRAM); SET; single event upset; state change; two photo absorption; TPA; RADIATION; IMPACT; RAY;
D O I
10.1109/TNS.2014.2321833
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Single-event upsets in HfO2/Hf 1T1R Resistive Random Access Memory (RRAM) structures are experimentally demonstrated by generating current transients in the access transistors of the memory cells. The relationship between the single-event upset threshold of the RRAM and the applied voltage is exponential, which is verified using TPA laser analysis and heavy-ion irradiation. Multiple-Event Upsets (MEUs) also occur, where individual ions incrementally change the RRAM's resistance until their cumulative effect causes an upset. Single-event models are presented that allow direct correlation of the voltage across the RRAM, caused by the ion-generated current transient, and the change in RRAM resistance. The RRAM is vulnerable only in the high resistance state, when a voltage capable of writing to the cell is applied to the bit line. This is approximately 0.5% of the memory element's operation time, leading to relatively low projected upset rates.
引用
收藏
页码:1717 / 1725
页数:9
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