High adhesive metal laminate manufacturing by low energy ion cascade treatments

被引：5

作者：

Chung, Yun M. ^{[1
]}

Han, Jeon G. ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Ctr Adv Plasma Surface Technol, Suwon 400746, South Korea

来源：

SURFACE & COATINGS TECHNOLOGY | 2007年 / 201卷 / 9-11期

关键词：

grid assisted magnetron sputtering; Cu clad laminates (CCL); adhesion;

D O I：

10.1016/j.surfcoat.2006.07.106

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Highly adhesive Cu clad laminates (CCL) without oxygen plasma treatment were fabricated by introducing Ti layer using grid assisted magnetron sputtering. The interfaces of polyimide and titanium obtained were studied by XPS. The results give evidence for the formation of Ti-O-C chemical bonds between two sides of the interface. These chemical bonds are believed to be responsible for the observed mechanical strength of the CCL bonding. © 2006.

引用

页码：5030 / 5034

页数：5

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