Analysis of bonded piezoelectric materials with a crack perpendicular to the interface subjected to in-plane loading

The plane problem for bonded functionally graded piezoelectric materials containing a crack perpendicular to the interface is considered when the material properties along x-axis vary in exponential form. The Fourier transform technique and dislocation density functions are used to formulate the problem in terms of a system of singular integral equations and obtained asymptotic analytical solution of crack-tip stress field. Numerical calculations are carried out, and the effects of crack geometric parameters on the stress intensity factor and the energy release rate are shown graphically. Crown Copyright (C) 2009 Published by Elsevier B.V. All rights reserved.